Circuit Board Suppliers

View our range of Circuit Board Suppliers Below

Leading the way with quick turn PCB and flex circuit technology – four decades of experience working in the PCB industry with cutting-edge layout, fabrication, and assembly under one roof.

Cicor offers highly complex printed circuit boards and hybrid circuits as well as comprehensive electronic manufacturing services (EMS) including microelectronic assembly and plastic injection molding.

Specializing in unique RF/MW and mmWave Printed Circuit Boards over three decades, Transline Technology has grown to become a hallmark of quality and innovation as a renowned PCB and microwave manufacturer.

Frequently Asked Questions

What minimum trace width, spacing, and aspect ratio tolerances can your manufacturing lines sustain?

For high-density interconnect (HDI) designs, our production facilities reliably manufacture fine-line traces with widths and spacings down to 3 mils (0.075 mm) in high-volume runs. Our advanced laser-drilling processes achieve an aspect ratio of up to 10:1 for standard through-holes, and 1:1 for blind and buried microvias. This level of precision allows layout engineers to safely route high-pin-count BGA packages with tight pitch configurations down to 0.4 mm without sacrificing signal routing channels.

We support a comprehensive suite of surface finishes tailored to your specific assembly methodology:
  • ENIG (Electroless Nickel Immersion Gold): The industry standard for fine-pitch surface mount devices (SMD), providing an exceptionally flat surface pad and excellent shelf life.
  • HASL / Lead-Free HASL (Hot Air Solder Leveling): A highly cost-effective option for robust, standard through-hole and low-density surface-mount assemblies.
  • OSP (Organic Solderability Preservatives) & Immersion Silver/Tin: Ideal for high-speed signal designs where minimizing the “skin effect” losses introduced by nickel barriers is a priority.

 
To satisfy demanding electrical and thermal profiles, our fabrication lines stock a wide variety of raw laminates beyond standard FR-4:
  • High-Speed/Low-Loss: Premium dielectrics (such as Rogers, Megtron 6, and Isola families) engineered for minimal dissipation factors (Df) and stable dielectric constants (Dk) into the millimeter-wave bands.
  • Thermal Management: Metal-core PCBs (MCPCBs) featuring integrated aluminum or copper substrates, designed specifically to dissipate heat out of high-power LED systems and power converter circuits.
  • Flex-Rigid: Specialized polyimide substrates configured for dynamic mechanical bending or tight, space-constrained architectural enclosures.
 
To eliminate the risk of field failures or wasted assembly components, 100% of bare circuit boards undergo rigorous structural testing:
  • AOI (Automated Optical Inspection): Scans every copper layer against your original Gerber/ODB++ design files to detect any trace shorts, cuts, or deviations before mask application.
  • Flying Probe / Electrical Testing: Validates netlist continuity and isolation across every test point and pad configuration on the outer layers to completely rule out hidden opens or short circuits.